- It is the machine used to grind the unused side edge parts of the wafer blocks cut in the wafer cutting machine during the operation of the production line and to re-mix the cream into the cream preparation.
- The particle of the wafer are grinded properly by means of helix and steel blades inside the machine.
- It's compatible for grinding wafer, cookies and cake particle.

Product Brand : Bismak
Product Name : Scrap Wafer Milling Machine
Product Model : BMS-011
Product Code : GF-1000