- It is the machine used to grind the unused side edge parts of the wafer blocks cut in the wafer cutting machine during the operation of the production line and to re-mix the cream into the cream preparation.
- The particle of the wafer are grinded properly by means of helix and steel blades inside the machine.
- It's compatible for grinding wafer, cookies and cake particle.
Product Brand : Bismak Product Name : Scrap Wafer Milling Machine Product Model : BMS-011 Product Code : GF-1000
Bismak Vural Makina Gıda Hayv. Ve Tic. San. Ltd. Şti founded in Karaman Industrial Zone in 2000 responds to needs of the sector with expert and dynamic team who has constantly self-improvement efforts, by using the latest technology that can be used, and also with the knowledge and experience which is continuously compatible with developing technology.